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1 - 10 of 22 search results for KaKaoTalk:vb20 200 |u:www.tcm.phy.cam.ac.uk where 0 match all words and 22 match some words.

  1. Results that match 1 of 2 words

  2. Slide 1

    www.tcm.phy.cam.ac.uk/~gjc29/talks/LorentzTalk2016.pdf
    3 Sep 2021: Graphical data. Composition Temperature YS. A 200 1100. A 400 1150. ... C 100 1050. Graphical data. Composition Temperature YS. A 200,…,1000 1100,…,650.

  3. Slide 1

    www.tcm.phy.cam.ac.uk/~gjc29/talks/CamnetTalk2019.pdf
    11 Sep 2021: Thermal resistance > 0.04 KΩ-1m-3. Yield stress at 900˚C > 200 MPa.

  4. Slide 1

    www.tcm.phy.cam.ac.uk/~gjc29/talks/OxfordTalk2017.pdf
    5 Sep 2021: Materials databasesFound 792 errors. Materials design. Low temperature thermometer. Increased drug dataavailable 200-times.

  5. Slide 1

    www.tcm.phy.cam.ac.uk/~gjc29/talks/CECAMTalk2021.pdf
    17 Jun 2021: Yield stress at 900˚C > 200 MPaTensile strength at 900˚C > 300 MPa.

  6. Slide 1

    www.tcm.phy.cam.ac.uk/~gjc29/talks/DuxfordTalk2018.pdf
    7 Sep 2021: Yield stress at 900˚C > 200 MPaTensile strength at 900˚C > 300 MPa.

  7. Slide 1

    www.tcm.phy.cam.ac.uk/~gjc29/talks/CaiusScienceEveningTalk2017.pdf
    5 Sep 2021: Low temperature thermometer. Going beyond materials. Increased drug dataavailable 200-times. Exploited data fromdifferent fidelities ofsimulations to designnew blade shapes.

  8. Slide 1

    www.tcm.phy.cam.ac.uk/~gjc29/talks/BakerHughesTalk2021.pdf
    7 Nov 2021: Yield stress at 900˚C > 200 MPaTensile strength at 900˚C > 300 MPa.

  9. Slide 1

    www.tcm.phy.cam.ac.uk/~gjc29/talks/EPFLTalk2018.pdf
    7 Sep 2021: Yield stress at 900˚C > 200 MPa. Tensile strength at 900˚C > 300 MPa.

  10. Slide 1

    www.tcm.phy.cam.ac.uk/~gjc29/talks/LouvainTalk2018.pdf
    7 Sep 2021: γ’ solvus > 1000˚C. Thermal resistance > 0.04 KΩ-1m-3. Yield stress at 900˚C > 200 MPa.

  11. Slide 1

    www.tcm.phy.cam.ac.uk/~gjc29/talks/EngineeringTalk2020.pdf
    11 Sep 2021: γ’ solvus > 1000˚C. Thermal resistance > 0.04 KΩ-1m-3. Yield stress at 900˚C > 200 MPa.

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